Toshiba introduces the BG3 Series SSDs featuring a single-package M.2 SSD form factor using Toshiba’s latest innovation 64-layer, 3-bit-per-cell (TLC) BiCS Flash along with a controller in a ball grid array package.
Toshiba introduces the BG3 Series SSDs featuring a single-package M.2 SSD form factor using Toshiba’s latest innovation 64-layer, 3-bit-per-cell (TLC) BiCS Flash along with a controller in a ball grid array package.
Toshiba introduces the BG3 Series SSDs featuring a single-package M.2 SSD form factor using Toshiba’s latest innovation 64-layer, 3-bit-per-cell (TLC) BiCS Flash along with a controller in a ball grid array package. The BG3 Series SSDs goes to Toshiba’s OEM customers starting today giving a hint of what’s to come on next-generation devices.
The Toshiba BG3 SSD Series features NVMe Revision 1.2.1 architecture and uses PCI Express Gen3x2 lanes. To save power and space, the BG3 uses Host Buffer Memory as a substitute for DRAMs. Combined with the benefits of SLC caching, the improved flash memory performance and flash management results to high performance transfer speeds of 1520MB/s sequential read and 840MB/s sequential write.
The Toshiba BG3 M.2 SSD Series is the industry’s smallest form factor offering with a surface-mount of 16mm x 20mm x 1.5mm single-package M.2 1620 flash chip and the removable M.2 2230 form factor. The BG3 Series is available in three different capacities which includes 128GB, 256GB and 512GB. With this, Toshiba aims to lead the innovation and development of next-generation mobile PCs and devices with designs adapting the likes of the BG3 SSD Series. Also with the compact size and low power consumption, the BG3 is also ideal for server-boot storage applications for data centres.
Visit Toshiba Memory division for more information and updates on Toshiba’s latest products and innovations at https://www.toshiba-memory.co.jp/en/index.html. Learn more about the Toshiba BiCS Flash memory here.
