FSP introduces the M370 panoramic chassis, a new mid-tower case designed to balance modern aesthetics, high airflow performance, and support for next-generation hardware platforms.
FSP introduces the M370 panoramic chassis, a new mid-tower case designed to balance modern aesthetics, high airflow performance, and support for next-generation hardware platforms.
FSP introduces the M370 panoramic chassis, a new mid-tower case designed to balance modern aesthetics, high airflow performance, and support for next-generation hardware platforms. Available in black and white variants, the FSP M370 adopts a semi-glass design and offers compatibility with back-connect motherboards for cleaner cable management.
The FSP M370 is engineered to accommodate high-performance gaming and creator systems, featuring support for graphics cards up to 400mm in length, CPU air coolers up to 180mm in height, and radiators up to 360mm. The chassis also ships with four pre-installed 120mm ARGB fans to provide out-of-the-box cooling performance.
Semi-Glass Design with Practical Layout
The M370 features a tempered glass side panel paired with a high-airflow perforated front panel, creating a balance between component visibility and thermal performance. FSP has positioned the front I/O panel along the side of the chassis, offering convenient access while maintaining a clean exterior appearance.
Optimised Airflow and Internal Layout
Designed with airflow as a priority, the FSP M370 utilises a fully ventilated front panel to maximise cooling potential. Internally, the chassis adopts a compartmentalised layout that separates the power supply and storage devices from the main chamber, helping to reduce cable clutter and improve airflow efficiency throughout the system.
Back-Connect Motherboard Compatibility
The FSP M370 supports the latest generation of back-connect motherboard designs, featuring dedicated routing cut-outs that allow power and data cables to be concealed behind the motherboard tray. This approach enables cleaner builds with minimal visible cabling, catering to users seeking a more refined system appearance.
Support for Next-Generation Hardware
FSP has designed the M370 with future upgrades in mind, providing clearance for graphics cards up to 400mm in length and support for CPU air coolers measuring up to 180mm tall. The chassis also accommodates liquid cooling solutions with support for radiators up to 360mm.
The FSP M370 will be available in two variants: the M370-BA in black and the M370-WA in white. FSP has not announced pricing or retail availability at the time of writing.
