FSP has expanded its compact enclosure lineup with the new S210, a small-form 23-litre chassis designed to offer full-size performance in a highly portable footprint.
FSP has expanded its compact enclosure lineup with the new S210, a small-form 23-litre chassis designed to offer full-size performance in a highly portable footprint.
FSP has expanded its compact enclosure lineup with the new S210, a small-form 23-litre chassis designed to offer full-size performance in a highly portable footprint. Despite its compact dimensions, the FSP S210 supports modern high-performance hardware, including long graphics cards, tall air coolers, and 240 mm liquid radiators—making it suitable for gaming, creative workloads, or a clean minimalist build.
The FSP S210 chassis maintains a lightweight structure and features an ergonomic carry handle for easy transport, ideal for users who frequently relocate their systems or need a capable PC for LAN events. With improved airflow, a clean interior layout, and a stylish tempered glass side panel, the FSP S210 brings practicality and aesthetics together in a refined small-form design.
FSP S210 Key Features
• Compact 23L form factor supporting up to a 340 mm graphics card
• Top-mounted 240 mm radiator support for improved cooling and cleaner internal layout
• 170 mm CPU cooler clearance for high-performance air coolers
• Ergonomic carry handle for convenient portability
• Tempered glass side panel with scratch-resistant durability
• Metal mesh ventilation for enhanced airflow and component cooling
• Storage support: 2× SSD + 1× HDD
• Front I/O: 2× USB 3.0
• Front-mounted PSU design supporting 140 mm ATX power supplies
Pricing and availability were not provided at the time of writing. Learn more about the S210 chassis at the FSP website.
